agilent hsmx-c265 surface mount chip leds data sheet description the hsmx-c265 is a reverse mount- able chip-type led for lighting the non-component side of a pcb board. in this reverse mounting configuration, this led is designed to emit light through a small cut-out hole in the pc board. features ? reverse mountable ? undiffused optics ? small 3.4 x 1.25 mm footprint ? operating temperature range of C30 c to +85 c ? compatible with ir solder reflow ? four colors available: red, orange, yellow, and green ? available in 8 mm tape on 7" (178 mm) diameter reels applications ? keypad backlighting ? symbol backlighting ? lcd backlighting ? status indication ? front panel indicator device selection guide part number color parts per reel hsms-c265 high efficiency red 3000 hsmd-c265 orange 3000 hsmy-c265 yellow 3000 hsmg-c265 green 3000 HSMH-C265 algaas red 3000 the hsmx-c265 is available in four colors. the small size, narrow footprint, and low profile make this series of leds excellent for backlighting, status indication, and front panel illumination application.
2 package dimensions absolute maximum ratings t a = 25 c parameter hsmd/g/s/y-c265 HSMH-C265 units dc forward current [1] 25 25 ma peak pulsing current [2] 100 100 ma power dissipation 65 65 mw reverse voltage (i r = 100 m a) 5 5 v led junction temperature 95 95 c operating temperature range C30 to +85 C30 to +85 c storage temperature range C40 to +85 C40 to +85 c soldering temperature see ir soldering profile (figure 6) notes: 1. derate linearly as shown in figure 4. 2. pulse condition of 1/10 duty and 0.1 ms width. 3.4 (0.134) 0.3 (0.012) 0.50 ?0.15
(0.020 ?0.006) 1.1 (0.043) polarity [3] cathode
mark (etched)
[anode mark for HSMH-C265] 1.1 (0.043) 0.50 ?0.15
(0.020 ?0.006) 1.2
(0.047) 1.25 (0.049) led die undiffused
epoxy pc board notes:
1. all dimensions in millimeters (inches).
2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified.
3. polarity of HSMH-C265 will be the opposite of what is shown
on above drawing. soldering
terminal 2 ?0.6 (0.028)
(green solder mask) cathode line
3 electrical characteristics t a = 25 c forward voltage reverse breakdown capacitance thermal v f (volts) v r (volts) c (pf), vf = 0, resistance @ i f = 20 ma @ i r = 100 m a f = 1 mhz r q j-pin ( c/w) part number typ. max. min. typ. [1] typ. hsms-c265 2.1 2.6 5 8 250 hsmd-c265 2.2 2.6 5 6 250 hsmy-c265 2.1 2.6 5 7 250 hsmg-c265 2.2 2.6 5 6 250 HSMH-C265 1.8 2.6 5 18 300 optical characteristics t a = 25 c luminous intensity peak wavelength dominant wavelength viewing angle i v (mcd) @ 20 ma [1] l peak (nm) l d (nm) [2] 2 q 1/2 degrees [3] part number color min. typ. typ. typ. typ. hsms-c265 her 2.5 10.0 630 626 170 hsmd-c265 orange 2.5 8.0 605 604 170 hsmy-c265 yellow 2.5 8.0 589 586 170 hsmg-c265 green 4.0 15.0 570 572 170 HSMH-C265 algaas 6.3 17.0 660 639 170 notes: 1. the luminous intensity, i v , is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. the dominant wavelength, l d , is derived from the cie chromatically diagram and represents the perceived color of the device. 3. q 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4 light intensity (iv) bin limits [1] intensity (mcd) intensity (mcd) bin id min. max. bin id min. max. a 0.11 0.18 n 28.50 45.00 b 0.18 0.29 p 45.00 71.50 c 0.29 0.45 q 71.50 112.50 d 0.45 0.72 r 112.50 180.00 e 0.72 1.10 s 180.00 285.00 f 1.10 1.80 t 285.00 450.00 g 1.80 2.80 u 450.00 715.00 h 2.80 4.50 v 715.00 1125.00 j 4.50 7.20 w 1125.00 1800.00 k 7.20 11.20 x 1800.00 2850.00 l 11.20 18.00 y 2850.00 4500.00 m 18.00 28.50 note: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your agilent representative for information on currently available bins. orange color bins [1] dom. wavelength (nm) bin id min. max. a 597.0 600.0 b 600.0 603.0 c 603.0 606.0 d 606.0 609.0 e 609.0 612.0 f 612.0 615.0 yellow/amber color bins [1] dom. wavelength (nm) bin id min. max. a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 color bin limits green color bins [1] dom. wavelength (nm) bin id min. max. a 561.5 564.5 b 564.5 567.5 c 567.5 570.5 d 570.5 573.5 e 573.5 576.5 tolerance: 0.5 nm tolerance: 1 nm tolerance: 0.5 nm tolerance: 15%
5 wavelength ?nm her green relative intensity 1.0 0.5 0 500 550 600 650 700 750 yellow orange figure 2. forward current vs. forward voltage. figure 3. luminous intensity vs. forward current. figure 4. maximum forward current vs. ambient temperature. figure 5. relative intensity vs. angle. 100 10 1 0.1 1.5 1.7 1.9 2.1 2.3 v f ?forward voltage ?v i f ?forward current ?ma green her orange yellow 01020 40 i f ?forward current ?ma 0 0.4 1.2 1.6 luminous intensity
(normalized at 20 ma) 30 0.8 0 35 0 20 60 80 100 5 i f max. ?maximum forward current ?ma t a ?ambient temperature ?? 40 15 25 30 10 r q j-a = 600?/w 20 r q j-a = 800?/w note: 1. all dimensions in millimeters (inches). relative intensity ?% 1.00 0 angle 0.80 0.60 0.50 0.70 0.20 0.10 0.30 0.40 0.90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 figure 1. relative intensity vs. wavelength.
6 figure 8. reeling orientation. figure 9. reel dimensions. note: 1. all dimensions in millimeters (inches). cathode side printed label user feed direction 10.50 ?1.0 (0.413 ?0.039) 59.60 ?1.00
(2.346 ?0.039) 20.20 min.
( 0.795 min.) 6 ps 178.40 ?1.00
(7.024 ?0.039) 3.0 ?0.5
(0.118 ?0.020) 4.0 ?0.5
(0.157 ?0.020) 5.0 ?0.5
(0.197 ?0.020) 13.1 ?0.5
( 0.516 ?0.020) 8.0 ?1.0 (0.315 ?0.039) figure 6. recommended reflow soldering profile. figure 7. recommended soldering pad pattern. 230? max. 10 sec. max. 4?/sec.
max. over 2 min. time temperature 4?/sec. max. 140-160? 3?/sec. max. 1.25 (0.049) 1.4
(0.055) 2.3
(0.091) 1.4
(0.055) 2.2 (0.087) dia. pcb hole
7 figure 10. tape dimensions. figure 11. tape leader and trailer dimensions. notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.1 mm (0.004 in.) unless otherwise specified. end start there shall be a
minimum of 160 mm
(6.3 inch) of empty
component pockets
sealed with cover
tape. mounted with
components there shall be a
minimum of 160 mm
(6.3 inch) of empty
component pockets
sealed with cover
tape. minimum of
230 mm
(9.05 inch)
may consist
of carrier
and/or
cover tape. 8.00 ?0.30
(0.315 ?0.012) user feed
direction dim. a
(see table 1) 3.50 ?0.05
(0.138 ?0.002) 1.75 (0.069) dim. c
(see table 1) 0.20 ?0.05
(0.008 ?0.002) carrier tape cover tape dim. b
(see table 1) 4.00 (0.157) 2.00 ?0.05
(0.079 ?0.002) 4.00 (0.157) 1.50 (0.059) hsmx-c265 series 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) table 1
dimensions in millimeters (inches) cathode dim. a
?0.10 (0.004) dim. b
?0.10 (0.004) part number dim. c
?0.10 (0.004) convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components . storage condition: 5 to 30 c @ 60% rh max. baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been open for more than 1 week baking recommended condition: 60 5 c for 20 hours.
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (408) 654-8675 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6271 2451 india, australia, new zealand: (+65) 6271 2394 japan: (+81 3) 3335-8152(domestic/interna- tional), or 0120-61-1280(domestic only) korea: (+65) 6271 2194 malaysia, singapore: (+65) 6271 2054 taiwan: (+65) 6271 2654 data subject to change. copyright ? 2002 agilent technologies, inc. obsoletes 5988-4568en april 18, 2002 5988-6270en
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